BeamPeek™

 
 
概要: 

BeamPeek™システムは、アディティブマニュファクチャリング（AM）レーザーのビームプロファイル（焦点径や位置の）測定と、パワー測定を同時に行うことができます。 良質なメンテナンスや製造部品の生産性を支援するため、これらのパラメーターが時間とともにどのように変化するかを追跡します。 

BeamPeek™は、レーザービームプロファイラーカメラ、パワーメーター、ビームダンプ、ビームスプリッター、および光学系を統合して、産業環境下でのアディティブマニュファクチャリングレーザー分析のための包括的なソリューションを提供します。

  • フォーカルスポットサイズ
  • 焦点面構築のため較正されたフォーカルスポット位置
  • レーザーパワー
  • レーザーパワー密度
  • 時間の経過に伴うスポットサイズとパワーの変化

BeamPeekは交換可能なビームダンパー・カートリッジを採用しているので、ファン空冷や水冷の必要なく、パッシブ冷却を用いて最大2分間まで1ｋWの連続測定を行うことが可能です。その工業デザインにより、製造プロセスに干渉することなく、製造プロセスに簡単に統合し、レーザー特性の分析を実行することができます。

お問合せ プロファイラ検索

仕様

仕様
  • 532nm, 1060-1080nm
  • 34.5µm - 2mm
  • 10 - 1000 Watts
  • 150mm-800mm
  • ISO 11146 Measurements
  • NIST traceable calibration ±3%
  • CE, UKCA, China RoHS
ビームプロファイラの選定は ビームプロファイラ・ウィザードをご利用ください。

製品概要

  • BeamPeek

    SP90609

    Beam Profiling, focal spot analysis and power measurement system for AM chambers

    御見積り
  • BeamGage ProfessionalBeamGageプロフェッショナル版
    レーザビーム解析用BeamGageビームゲージソフトウェア・プロフェッショナル版は、スタンダード版の機能に追加機能が含まれています。全てのカメラに対応、ウインドウが仕切られて表示されるので1台のカメラでマルチビーム解析に対応、ユーザのアプリケーションに最適化できるよう.NETオートメーションインターフェースに対応しています。
  • StarLab

    StarBright、StarLite、Juno、NovaII、Vega、Pulsar-1/2/4、Quasar、EA-1対応StarLabソフトウェア。コンピュータをパワーメータとして使用可能、最大8台のセンサと接続可能。COMオブジェクトやLabVIEW Visなどユーザ側で自由にプログラムを組む事が可能。

  • BeamPeek Tools

    Software for BeamPeek Temperature Sensors reading, Focal plane and Optical axis position

    To install the BeamPeek Tools

    To download the BeamPeek Start Setup for BeamGage Professional

FAQ

Is a periodical calibration required for the BP?

Yes, since the BeamPeek includes Ophir regular Power Meter.

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Where is the Camera sensor/Focal plane positioned?

Unlike the BeamCheck that has the focal plane set so that the camera sensor is in focus when laser focus is positioned at bed surface, the BeamPeek camera sensor is approximate 75mm (the exact value is calibrated individually for each device) over the base/machine bed. To get the beam focus on camera sensor the machine bed must move down the by the calibrated value. The reason for this setup is improved power handling: higher maximum power and longer exposure time to high power.

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What is the minimum waiting time to get power measurements results?

Minimum response time for power measurements is 3 seconds, as for power meters with thermal head.

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IF power is higher value or longer exposure time than maximum allowed will the BeemPeek suffer heavy damage? How would I know if the device is damaged?

The BeamPeek is designed with some spare regarding overload, power or exposure time; if the recommended values were overpassed there are simple visual inspection besides the functional test that customer can perform: removal of Beam Dump tray, checking cleanliness of the protective window (can be removed and cleaned of outgassing due to very high power density or too long exposure), remove and inspect the diffusing interchangeable lens and looking thru the system aperture with lens removed to verify optics integrity in case of too high power.

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If NIR laser wavelength 1070nm is used, which PM wavelength should be selected for measurements 1064nm or 1080nm?

Select the wavelength which is closest to laser wavelength, in this case 1064 is closer than 1080.

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動画

BeamPeek™, High Power Laser Beam Analysis and Power Measurement System for Additive Manufacturing BeamPeek™, High Power Laser Beam Analysis and Power Measurement System for Additive Manufacturing

An integrated beam analysis and power measurement system for fast, accurate, real-time measurement of lasers in additive manufacturing chambers.
The BeamPeek system provides simultaneous beam profiling, focal spot analysis, and power measurement in just three (3) seconds. There is no need for water or fan cooling as the system includes a replaceable passive cooling beam dump tray that eliminates downtime between measurement sessions (Patent-Pending cooling solution).
The BeamPeek system is ideal for field service testing of additive manufacturing chamber powder beds. It is able to withstand chamber conditions, including the presence of metal powder residuals and when cooling agents or airflow connection points are not available.