LBS-300HP-NIR Attenuator
LBS-300HP-NIR Attenuator

LBS-300HP-NIR Attenuator

Beam Splitter for High Power Lasers NIR

The LBS-300HP-NIR is a patent pending technology beam splitter for High Power lasers that allows measuring NIR (~1064nm) focused or collimated laser beam profiles up to 5kW or 15MW/cm².
The LBS-300HP-NIR operates by reflecting a fraction of the incoming beam through the front surface of each of a pair of orthogonally oriented wedges. Less than 0.0001% (1/10 ⁶) of the beam is reflected towards the Ophir Beam Profiler Camera. This enables beam shape, focal spot, beam waist, M² of a high-power laser; up to 5kW or 15MW/cm².
Relative power can be measured by placing an Ophir power sensor after the first wedge, thereby measuring the laser beam after being reduced to 0.1% (1/10³).
99.9% of the laser beam passes through, ideal for absolute power measurement.
Each optical path through the LBS-300HP-NIR provides uniform attenuation of any beam shape (Gaussian, flat-top, doughnut, etc.) while preserving the polarization and overall profile of the incoming laser beam thus providing accurate sample of incident beam. A 1.035-40 thread is provided behind each wedge along the axis of the output beam. These can be used to directly mount accessories with 1” lens tubes such as beam dumps or power/energy sensors.
Applications for LBS-300-HP laser beam profiling attenuator include laser cutter alignment, laser additive manufacturing, selective laser melting (SLM), direct metal laser melting (DMLM), power measurement and other high power laser beam analysis applications, laser powder bed fusion (LPBF) and 3D printing


  • C-mount
  • ~1064 nm
  • 5kW , 15MW/cm2
  • 0.000025% - 0.0001% (1/10⁶)
  • UVFS
  • 15mm
Need help finding the right beam profiler? Try our Beam Profiler Finder


The LBS-300HP-NIR combination beam sampling and beam apsorption systems available with the following options.
  • LBS-300HP-NIR


    Compact laser beam sampling system; wavelength ~1064 nm

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Is LBS-300HP-NIR suitable for my laser?

The LBS-300HP-NIR is designated for NIR (~1070nm) lasers operating from 500W up to 5KW or up to 50MW/mm².
Other wavelengths are also possible to be measured; however the specifications might change because all trials were conducted using 1050-1070 nm lasers.

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What is the difference between LBS-300HP-NIR and other beam splitters?

The LBS-300HP-NIR uses specially treated material that provides extremely low reflection and high laser damage threshold, enabling beam attenuation by around a million times while keeping all beam parameters. This extreme attenuation enables measuring High Power laser beam profile focused on a beam profiler CCD.

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What is the laser power attenuation of LBS-300HP-NIR?

A specification defines beam attenuation of a million, meaning less than 0.0001% (1/10) of the beam is reflected towards beam profiler or power meter, however, this parameter can vary from unit to unit. In the majority of units the reflection even less than 0.0001%. The median reflection is 0.000075% and can vary by +/-20% (relative). The exact reflection from each surface is measured during the final production QC and documented in COC supplied with the unit. You can also verify the real reflection of your unit with Ophir support team

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Can I use LBS both for beam profiling and power measuring?

Yes, the main function of LBS-300HP-NIR beam splitter is Beam profiling, however it performs a 3-way beam splitting:

Less than 0.0001% (1/10⁶) of the beam is reflected in one direction and less than 0.1 % in another while remaining 99.9% of incident laser beam is transmitted.

This allows user to measure one of the 3 beams, depends on available power measurement equipment and setup convenience.

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What are environmental conditions for LBS-300HP-NIR operation and storage?

We recommend operating and storing the LBS-300HP in dust-free conditions, like a regular office or laboratory environment.
Dust and other volatile particles on the wedge surface might cause reflection change and influence the measured beam profile.
Harsh industrial environment operations will require a chamber for isolation.

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How to prevent LBS-300HP wedge surface contamination?

Any contact with UVFS wedges installed in the LBS-300HP assembly can cause damage and reflection change resulting in beam profile distortion. Thus, it's recommended to avoid even the slightest contact with glass surface with neither hand , paper or cloth.

Operating and storing of LBS-300HP at conditions free of volatile particles, like a regular office or laboratory environment. Harsh industrial environment operations will require isolation.

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How to clean the wedges?

In case of surface contamination, we recommend contactless cleaning of wedge surface by rinsing it with a chemically pure solvent such as Ethanol, Methanol or IPA (Isopropyl Alcohol), followed by prolonged gentle nitrogen or pure compressed air purging.

Please ensure solvent and gas purity and lack of moisture in order not to contaminate the wedge surface.

If contamination is not removed after cleaning, please consider whether it interferes your laser beam. The spot might be peripheral and not in CA of the laser.

In case the spot is in the laser CA, please contact Ophir support for replacement.

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How to deal with removable Beam Blocker?

The beam blocker is designated to keep one wedge surface protected during handling and shipping. It can be left attached for low power laser operations. However, in the case of high-power laser irradiation scattered light might interfere with beam profile measurement and cause offset. In case of such offset, we recommend removing the beam blocker.

After removal, an additional laser output, having less than 0.1% of incident beam power will be reflected. That beam could be used for simultaneous measurement of laser power via Ophir Power Meter in addition to beam profiler.

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How to direct laser exactly to the middle of LBS-300HP aperture?

Please use red alignment beam and a C-mount cap with target on it to aim directly to middle of the Input port.

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How to use LBS-300HP with Beam Dump

Generally, any beam dump can be used. We recommend using Ophir Beam Dumps with high absorbance at 1070nm and locate it at least 10cm from LBS-300HP to avoid scattered light reaching beam profiler CCD.

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Should I use C-mount extension tube between LBS and beam profiling camera?

Due to such significant attenuation, some light scattered from wedges might interfere correct beam profile measurement and cause offset. Thus, in case the setup allows it we recommend distancing the CCD from wedges by 50, 75 or 100mm C-mount extension tube between LBS-300HP and beam profiler.

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For how long can I use LBS?

Generally, continues usage of LBS-300HP is limited only by temperature increase, thus in case the temperature is mild, there is no limitation.

According to tests, after 10 minutes at 2kW lasing the temperature is increased by 16 Cº and after 4kW lasing increased by 23.4 Cº.

It's not recommended to overheat the LBS-300HP assembly in order not to cause thermal lensing effect of ND filters.

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What should be my Safety concerns while using LBS-300HP?

Regular laser safety precautions should apply. Please note, that the main incident beam will exit the LBS-300HP refracted approximately 6°. Provision must be made to safely contain the transmitted beam by beam dump or power meter.

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Can I use my LBS-300HP with a Pulsed Laser?

The beam splitter is designated both for CW and pulsed lasers. The allowed energy density of 1064nm pulsed laser should not exceed the equivalent of 15MW/mm².

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The LBS-300HP-NIR beam splitter allows camera-based beam profiling for high power lasers.

Learn more in the following video or see our recent article ‘Overcoming the Challenges of Measuring High Power NIR Lasers’.


Tutorials and Articles

Analyzing Small, High Power Beams at Focus in Manufacturing Applications

Lasers are increasingly deployed in manufacturing applications, being pushed to higher and higher output powers and smaller and smaller beam sizes to work faster and with higher precision. Determining the beam profile at the beam focus of these lasers is critical to verify and improve manufacturing product quality. However, there are enormous challenges that must be overcome to capture the beam profiling data. Read more...

Imaging UV light with CCD Cameras

Is it possible to image a UV laser with a Silicon Sensor CCD camera offered by Ophir-Spiricon? The answer is yes, but the direct UV light ablates Silicon CCD chips over time. The ablation is cumulative and depends on the intensity, the wavelength, and the duration of the light on the sensor. The best choice for imaging UV light without damage is to avoid directly imaging the beam on the CCD sensor by using an UV image converter... Read more...

White Paper – Keeping Your Additive Manufacturing Laser in Spec

There is little debate about how Additive Manufacturing is adding benefits and changing the face of manufacturing in our modern age. Additive Manufacturing allows for the manufacturing of more customized parts, using more specialized materials, and will eventually create a more localized, rapid, and agile distribution network than what have been used to. Read more...

Laser Measurements in Materials Processing: How and When They Absolutely, Positively Must Be Made

19th century British physicist and engineer William Thomson, 1st Baron Kelvin, was the first to say, “If you can’t measure it, you can’t improve it.” When applying this principle to improving laser-based processes, there are a variety of parameters that must be measured. Given the continuously rising power of laser systems in material processing, the requirements for measurement systems are more challenging than ever. Which technologies are available to measure high-power lasers? How often should they be measured? What measurements should be tracked? When this data is collected, what should be done with it? Read more...

Overcoming the Challenges of Measuring High Power NIR Lasers

BackgroundHigh power laser application has significantly increased in recent years due to new production techniques that enable cheaper manufacturing and operating costs. Applications of high-power lasers that seemed exotic a few years ago are now considered routine in material processing and micromachining. Such material processing applications as welding, cutting, additive manufacturing, marking, and engraving are now performed using lasers, enabling higher precision, faster rates, and increased variability. In addition to the material processing industry, increased use of high-power Read more...


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