PCB Via Drilling

Laser processing technologies are being increasingly used in the printed circuit board (PCB) industry, above the traditional technologies usually used for manufacturing electrical components. This is due to their faster speed, higher precision, and increased flexibility to suit a range of different processes in the industry.

effects of operating current level on the output spectrum of a laser diode

Manufacturing PCBs involves drilling holes, called vias, or microvias. These holes allow electrical connections between layers of the circuit board. Over time, these holes have become smaller and smaller, requiring a laser drilling system with extreme precision. This can be achieved using CO2 lasers, UV lasers, or a hybrid of the two.

The optical components used in such laser systems must be of extremely high quality. Ophir manufactures a range of optical components suitable for 9.4 μm PCB via drilling equipment, including lenses, mirrors, prisms, and thin film polarizers. Ophir utilizes cutting-edge technologies and unique coatings for high precision and top performance results.

Ophir’s scan lenses for 9.4 μm via drilling equipment are customized specifically for this challenging application. They provide small spot sizes with tight tolerances, excellent beam roundness, high tele-centricity, wide scanning areas, AR coatings for high incidence angles, and diffraction limited performance.

High Precision CO2 Optics & Coatings for 9.4 µm PCB via Drilling Equipment

Coating Types

  • Anti Reflection (AR)
  • Diamond Like Carbon (DLC)
  • Phase Shift (PS)
  • Metal Mirror Reflector (MMR)
  • Thin Film Polarizer (TFP)
  • Absorbing Thin film Reflector (AFTR)

Key Benefits

  • Low absorptance
  • Low reflectance lenses (AR)
  • High reflectance (Mirrors)
  • High durability (DLC)
  • Strict surface quality

Optics Types

  • ZnSe lenses
  • Silicon Mirrors
  • Cu Mirrors
  • Thin Film Polarizers
  • ZnSe Prisms
  • Knife edge Mirrors
  • Beam Splitters

Contact us for further details.

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